TE Connectivity 1-2040374-4 Application: Production Assembly Process Feature: Pick and Place Cover, Plastic CAP Chip Compatibility: 722 PGA Devices with 1.219 x 1.219 Contact Pattern Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Flash Contact Style: Stamped + Formed Frame Style: Closed Grid Size: 35x35 Grid Spacing (mm [in]): 1.219 x 1.219 [.0479 x .0479] Heat Sink Attachment: Without Housing Color: Black Housing Material: Thermoplastic - GF Insertion Force: ZIF Lead Free Solder Processes: Not reviewed for lead free solder process Number Of Positions: 722 Packaging Method: Tape Mounted on Reel Pcb Mount Style: Surface Mount Profile: Standard Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: FS1, Socket 722 Zif Actuator: Single Lever